Silicon Wafer Resizing/Coring Services

MPE, Inc. offers incredibly accurate and efficient silicon (Si) wafer resizing. Wafer resizing is sometimes referred to as wafer coring, re-sizing cut down, cut-down, downsizing, down-sizing, size reducing or size reduction. We can accommodate any sized order, no matter how large or small. Our process is efficient, innovative, and ESD friendly. Our proprietary process causes less stress to the silicon wafer than other resizing methods. We also round wafer edges to eliminate edge chipping.

Capabilities

The following are our silicon wafer resizing capabilities:

  • Process any silicon wafer size up to 300mm wafer
  • Process wafers as thin as 0.150mm
  • Achieve completed resized wafers anywhere from 50mm to 200mm
  • Produce semi-standard flat +/- 0.002 degrees
  • Tolerance of +/- 0.100mm on the OD dimension
  • Tolerance of +/- 0.050mm on the center position
  • Offset the wafer center to maximize the die yield
  • Laser scribe the wafer ID on the resized wafer for wafer identity control
  • Wafer edge rounding / beveling
  • Use DI water or re-ionized DI water
  • We work to have your project turned around as quickly as possible and can process your order with a one day turnaround, if necessary

We have the following ESD preventions in place:

  • Wrist Straps
  • Anti-static mats
  • Ion generators
  • ESD dicing film
  • Re-ionized DI water
  • Low-resistivity dicing solution that is especially suitable for static-sensitive devices
  • Ionized air guns

For any additional questions about our wafer resizing services, please call us at 1-877-MPE-DICE.