Custom Wafer Dicing and Wafer Resizing
MPE, Inc. (Micro Precision Engineering) is a corporation that was founded in 1993 to provide quick and efficient custom wafer dicing and wafer resizing services. Over the years, we have worked with hundreds of satisfied customers all over the world. Our customers have been involved in an array of different industries, including MEMS, Military, Medical, Semiconductor and MicroOptics. This has allowed our team, which has a combined total of 40 years of experience, to work with virtually every type of material in the industry, including Alumina, Aluminum Nitride, Fused Silica, Glass, Germanium, Lexan, SiC, Silicon-Germanium (SiGe), SOI, and Silicon wafers. We can accommodate all material sizes up to 300mm/ 12” in diameter and 10mm thick.
Producing Excellent Cuts
Our facility, located just northeast of Dallas, Texas, is 8,000 square feet and includes multiple rooms equipped to safely and efficiently process material. Each room has several ESD measures in place, including wrist straps, ESD mats, ionized work stations, and ESD dicing film (for all ESD sensitive material). Our state of the art equipment, coupled with our outstanding process knowledge and experience, allow us to produce excellent cuts with minimal chipping. We can work with any size semiconductor manufacturing firm. For smaller semiconductor firms without an in-house dicing facility, we can take care of all of your wafer dicing and resizing needs. For medium to large semiconductor manufacturing firms that just cannot keep up with their orders, we can help by taking care of your overflow or assisting with R&D projects.
Your Satisfaction is our #1 Priority!
MPE, Inc. is committed to outstanding customer service and your satisfaction is our #1 priority. We pride ourselves on our ability to complete all jobs in a timely and efficient manner. We process hundreds of wafers per month, with a normal lead time of three to five days. In most cases, we do have the ability to expedite wafers within one day, for those who need their material back immediately. In fact, customers can even bring their material in and wait in our lobby while we process it! Along with our prompt service, our prices are extremely competitive. This is primarily due to the fact that we use the versatile Loadpoint Limited dicing saws and a process flow that eliminates any unnecessary tasks. We utilize work orders, job travelers, archived customer dicing parameters, and custom procedures to process material accurately and efficiently.
Please see our wafer dicing capabilities and wafer resizing capabilities to see what we have to offer! For any firm that specializes in manufacturing computer chips, micro-machines, and lenses, please call us at 1-877-MPE-DICE, contact us via email, or fill out the request a quote form.
