Many customers utilize MPE to produce custom-sized pieces from larger substrates or wafers available from various third-party material suppliers. For example, we can dice larger glass optical filters (i.e. bandpass or neutral density) purchased from optical parts suppliers to create pieces with unique dimensions for any application. Companies specializing in applying thin film coatings to wafers or substrates may utilize MPE’s dicing services to allow their product to be offered in any size. MPE can also create test pieces or “coupons” from any bare or coated semiconductor wafer for research purposes. Many customers also employ MPE for dicing of wafers or substrates after metallization or bumping is patterned.